Platform
Qualcomm Dragonwing IQ10 Series; for robotics, industrial automation and Physical AI edge devices
AI performance
Up to 700 TOPS; 350 dense TOPS INT8, for LLM/VLM/VLA and robot foundation models
CPU
18-core Qualcomm Oryon CPU
GPU / NPU
Qualcomm Adreno GPU + dedicated NPU, supporting high-concurrency vision, inference and graphics
Memory
Reference design: 64GB LPDDR5x; module production configuration defined per project
Storage
Reference design: 512GB UFS4; supports PCIe Gen5 NVMe expansion
OS / SDK
Ubuntu Linux、ROS 2、AI Runtime、OTA/FOTA、Fleet Management、MLOps
Cameras / sensors
Platform supports 20+ camera sensors; reference design supports 12× GMSL2 cameras plus LiDAR, Radar, IMU and ToF
Display interface
Reference design: 2× DisplayPort 2.1 MST, supporting multi-display robotics and industrial displays
High-speed interfaces
PCIe Gen5 NVMe, USB 3.2 Gen2, SPI, I2C, UART, GPIO and more
Wireless & network
2× 10GbE, 1× 2.5GbE, 4× 1GbE EtherCAT; Wi‑Fi 7/BT with optional 5G module
Motion / control
8× CAN-FD, EtherCAT and TSN-ready Ethernet for robot motion control and industrial fieldbus
Functional safety
Dedicated safety island, with SIL-3 functional safety planned
Robotics software
Supports ROS 2, SLAM, multi-sensor fusion, AI inference, fleet management and remote updates
Power
Reference design: 12V/24V nominal input with 26V input protection; module power per the hardware manual
Environment
Reference design: -10℃~+70℃ (dependent on use case); module temperatures per production specs
Product lifecycle
Qualcomm Product Longevity support to 2038 (subject to official page updates)
Target applications
Humanoid robots, AMR/AGV, collaborative robots, industrial automation, edge AI boxes, drones and inspection equipment
Development support
Evaluation carrier board, reference designs, BSP, model toolchain and FAE support
Notes
Onboard storage, dimensions, I/O routing and certification are defined by the production version